NOW ENROLLING
SUMAS Admission
Introduction: Grounding, ground plane, digital ground, analogue ground, power decoupling, inductance and capacitive effects, feedthrough capacitors. Soldering techniques for pass-through and surface mount components, desoldering. Breadboarding, veroboarding. Wire wrapping techniques. Radio Frequency design and implementation techniques. Printed Circuit Board techniques, and production of PCB. Use of PCB CAD packages. Construction exercises using different prototyping techniques.